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The
following files are previewed by the picture on the left and an
introduction is provided under the title of the animation.
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Falcon 50 (28
seconds)
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This animation shows the temperature distributions of optical
mask due
to electron beam (e-beam) patterning of IBM Nighteagle / Falcon layouts.
A serpentine writing strategy was used in this simulation. The thermomechanical
distortions are calculated by using those temperature results as thermal loadings. |
falcon
50.avi
80 MB
falcon
50.wmv
6.8 MB
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Creating a checkerboard pattern on an optical substrate using electron beam patterning
(59 seconds) |
The animation shows the patterning of an optical substrate using a 2 µm X 2 µm shaped beam.
The pattern, a checkerboard, is patterned with a serpentine writing strategy. The beam has a
current density of 96 A/cm^2. Each flash is on for a duration of 0.1 µs with a 0.1 µs delay
between consecutive flashes. Top and cross sectional views through the second row of
patterning are shown. |
alexfinished2.wmv
14.4 MB |
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EUVL
Reticle Long-Term Exposure Thermal
Simulation (26
seconds) |
This simulation shows the long-term
thermal response of the EUVL reticle to heating in the exposure tool.
The wafer initially heats up from ambient temperature until it
reaches a quasi-equilibrium condition where it heats up during the
patterning of a full device wafer and cools down when the heating ceases
when during a wafer change. The
thermal expansion of the reticle, shown greatly magnified is also included
in the simulation. |
EUV
Heating.wmv
6.4 MB |
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Thermal Simulation of the EUVL Reticle
during Exposure (62
seconds) |
A
column of extreme ultraviolet light is scanned across a reflective
lithographic reticle.
A significant fraction of the incident energy is absorbed which
heats reticle.
The following is a computer simulation of the exposure heating and
the resulting temperature changes. |
EUV Scan.wmv
11.2 MB |
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Bright-field / Dark-field EUVL Reticle Thermal
Simulation (99 seconds)
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This
simulation shows the long-term thermal response of the EUVL reticle to
heating in the exposure tool.
An extreme in pattern coverage where the left half of the reticle is
unpatterned (bright-field) and the right half is 100% patterned (dark-field)
is modeled.
The wafer initially heats up from ambient, and then temperatures
oscillate between the exposure and wafer change cycles.
The right half of the reticle is hotter because of the increased
energy absorption in the fully patterned region.
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carl_enst.wmv
13.6 MB
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SCALPEL
(63 seconds) |
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SCALPEL&
commentary.avi
307 MB
SCLAPEL&commentary.wmv
15.6 MB |
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Deflection
of a Mask (2 seconds) |
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displacement.avi
4 MB
displacement.wmv
882 K |
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Symmetrical Mesh
Heating (3 seconds)
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symm_elements.avi
7.4 MB
symm_elements.wmv
743 K |
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Flythrough
of a Deformed Mask (41 seconds) |
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deformed.avi
35 MB
deformed.wmv
6.5 MB |
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Mesh
Flythrough (23 seconds) |
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mesh_flythrough.avi 38
MB
mesh_flythrough.wmv
6.1 MB |
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Strut
Flythrough (26 seconds)
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Our
attempt at a Star Wars look at struts |
flythrough.avi
52 MB
flythrough.wmv
6.5 MB |
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For
the following three VRML animations (.wrl files)
you will need to download
and install Cosmo
Player.
This
will allow you to move the model while it's animating.
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Ret6a
(5.4 MB)
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Symmetrical
Model
(47.8 MB)
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ULE
Wafer
(32.5 MB)
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